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Nexus Mini™ Series

mini
System Specification
Process Type Thermal Time Divided ALD
Gases Flow Type Lateral Type(Traveling Wave)
Available Film Dielectric Film (High-K, Low-K)
Metal Oxide, Metal Sulfide
Film Uniformity Al2O3 ± 1% on the 200mm x 200mm Square Substrate
Substrate Size & Temperature Nexus Mini 2.5 : 25 ~ 250 ℃ ± 1% On The Substrate of 8” or 200x200mm2
Nexus Mini 4.5 : 25 ~ 450 ℃ ± 1% On The Substrate of 6” or 150x150mm2
System Dimension
( W x L x H )
760 x 480 x 435(Substrate to Ground) mm
Base Pressure < 5.0 x 10-3 Torr
Control System Provided laptop computer & Windows 10 based, advanced and basic GUIs with Import/export of Excel compatible recipes and data
Number of MFC Carrier & Purge gas / 3EA / Each of 500 SCCM
Optional Install max 4EA Number of Canister
Added Throttle Valve
Facilities Requirements Specification
Gases Ar, More than 4~6 Bar
Air CDA, More Than 4~6 Bar
Power of Mini ALD 단상, 220V, 60Hz, 40A 이상
Vacuum Pump Needed Vacuum Oil Rotary Pump ≤1000 L/min
 

Linear Growth without growth delay from 100 to 400 cycles at process temperature of 100℃.